| Manufacturing |
Standard
|
Advanced
|
Emerging
|
| |
Products
|
Products
|
Products
|
| |
|
|
|
| Min. SMT
Pitch |
0.015
|
0.012
|
0.010
|
| Min. BGA Pitch |
0.8mm
|
0.75mm
|
0.5mm
|
| Min. Dielectric
Thickness |
0.005
|
0.004
|
0.002
|
| Minimum
Soldermask Webbing |
0.003
|
0.0025
|
0.002
|
| Min. Base
Copper Weights |
0.007
|
0.0035
|
0.0035
|
| Max. Finished
Copper Weights |
0.007
|
0.030
|
0.070
|
| Average
Layer Count |
10
|
16
|
20
|
| Largest
Panel Size |
18x24
|
21x24
|
24x26
|
| Warpage
- Design Dependant |
1.0%
|
0.75%
|
0.50%
|
| Tolerance
- Plated Holes - Design Dependant |
+/-0.003
|
+/-0.0025
|
+/-0.002
|
| Impedance
Tolerance |
+/-10%
|
+/-7%
|
+/-5%
|
| Drilling
Aspect Ratio - Drilled Hole Size |
10:1
|
11:1
|
>12:1
|
| Min. Drilled
Hole Size (vias) |
0.010
|
0.08
|
0.006
|
| Min. Finished
Hole Size (vias) |
0.008
|
0.006
|
0.004
|
| Min. Outer
Layer Via Land Size |
0.018
|
0.015
|
0.013
|
| Min. Inner
Layer Via Land Size |
0.017
|
0.014
|
0.012
|
| Min. Via
Relief on Power/Ground Planes |
0.024
|
0.022
|
0.020
|
| Min. Blind/Buried
Via Land Size |
0.016
|
0.015
|
0.013
|
| Min. Blind/Buried
Via Hole Size (Drilled) |
0.010
|
0.008
|
0.006
|
| Min. Line
& Space |
0.005
|
0.004
|
0.003
|
| Line Width
Tolerance +/- |
0.001
|
0.0075
|
0.0005
|
| Layer to
Layer Registration +/- |
0.005
|
0.004
|
0.003
|
