Technology

Standard

Advanced (R & D)

Layer Count

1-16

1-26

Largest Panel Size

18 x 24

21 x 24

Board Thickness

0.010-0.250

0.010-0.300

Min Core Thickness

0.003

0.0025

Min Dielectric Thickness`

0.004

0.003

Min Base Copper Weight

1/4oz

1/8oz

Max Finished Copper Weight

5oz

10oz

Min Line Width/Space

0.004

0.002

Min SMD Pitch

0.015

0.012

Min BGA Pitch

0.0315 (0.8mm)

0.0295 (0.75mm)

Min Drilled Hole Dia

0.008

0.006

Min Finished Hole Dia

0.005

0.002

Max Aspect Ratio

10:1

12:1

Min Outer Layer Via Land Size

0.018

0.016

Min Via Pad Diameter

0.018

0.016

Min PTH Pad to Plane Spacing

0.010

0.008

Blind/Buried Via's

Yes

Yes

Micro Via

No

No

Non-Conductive Epoxy Via Fill

Yes

Yes

Conductive Epoxy Via Fill

Yes

Yes

100% Electrical Test (Grid or Flying Probe)

Yes

Yes

Manufacturing Tolerances

Board Thickness Tolerance

+/-10%

+/-5%

Line Width Tolerance

0.001

0.00075

Plated Hole Tolerance

+/-0.003

+/-0.002

Hole Location

+/-0.003

+/-0.003

Warpage - (Design Dependant)

.70%

.50%

Impedance Tolerance

+/-10%

+/-5%

Layer to Layer Registration

0.005

0.004

Materials

Std FR-4

Yes

Yes

Hi-Tg FR-4

Yes

Yes

Halogen Free

Yes

Yes

Hi-Frequency

Yes

Yes

Polyimide's

Yes

Yes

Exotics

Yes

Yes

Aluminum

Yes

Yes

Board Finish

Standard

Advanced (R & D)

Soldermask

Taiyo PSR-4000 BN/MP

Yes

Yes

Taiyo PSR-4000 DE (Halogen Free)

Yes

Yes

Min Dam

0.004

0.003

Gasket Design (S/Mask Defined Pads)

Yes

Yes

Hole Plug

Yes

Yes

Surface Finish (RoHS)

Immersion Gold (ENIG)

Yes

Yes

Immersion Silver

Yes

Yes

Immersion Tin

Yes

Yes

Lead Free HASL

Yes

Yes

Electrolytic Hard Gold (Full/Tabs)

Yes

Yes

Entek (OSP)

Yes

Yes

Surface Finish (Non-RoHS)

HASL

Yes

Yes