Capabilities and Tech Road Map
LAZER-TECH’S CAPABILITIES
LAYER COUNT:
UNCLAD - 16 LAYERS
(QTA) QUICK TURN AROUND:
Proto-Type Product (QTA)
24 hrs – 5 Days
Production Quantities (QTA)
5 - 10 Days
Standard Lead-Time
15 days
MATERIALS:
Standard FR-4, HTg, RoHS & Exotic Materials
FINISHES:
HASL: Hot Air Solder Leveling
RoHS FINISHES:
ENIG: Electroless Nickel Immersion Gold.
Immersion Silver, Immersion Tin
Profile: Routing or Scoring
| CUSTOMER SERVICE: Customer Driven 100% Quality Assurance On-Time Delivery. Competitive Pricing 100% Netlist Electrical Testing: Universal, Double Access & Flying Probe Test Selective Gold Plating Customer Support Rep Support ENGINEERING SUPPORT: |
CERTIFICATIONS: TECHNOLOGY: LAB FACILITY: |
TECHNOLOGY ROAD MAP
| Manufacturing | Standard Products | Advanced Products | Emerging Products |
|---|---|---|---|
| Min. SMT Pitch | 0.015 |
0.012 |
0.010 |
| Min. BGA Pitch | 0.8mm |
0.75mm |
0.5mm |
| Min. Dielectric Thickness | 0.005 |
0.004 |
0.002 |
| Minimum Soldermask Webbing | 0.003 |
0.0025 |
0.002 |
| Min. Base Copper Weights | 0.0007 |
0.00035 |
0.00035 |
| Max. Finished Copper Weights | 0.007 |
0.030 |
0.070 |
| Average Layer Count | 10 |
16 |
20 |
| Largest Panel Size | 18x24 |
21x24 |
24x26 |
| Warpage - Design Dependant | 1.0% |
0.75% |
0.50% |
| Tolerance - Plated Holes - Design Dependant | +/-0.003 |
+/-0.0025 |
+/-0.002 |
| Impedance Tolerance | +/-10% |
+/-7% |
+/-5% |
| Drilling Aspect Ratio - Drilled Hole Size | 10:1 |
11:1 |
>12:1 |
| Min. Drilled Hole Size (vias) | 0.010 |
0.08 |
0.006 |
| Min. Finished Hole Size (vias) | 0.008 |
0.006 |
0.004 |
| Min. Outer Layer Via Land Size | 0.018 |
0.015 |
0.013 |
| Min. Inner Layer Via Land Size | 0.017 |
0.014 |
0.012 |
| Min. Via Relief on Power/Ground Planes | 0.024 |
0.022 |
0.020 |
| Min. Blind/Buried Via Land Size | 0.016 |
0.015 |
0.013 |
| Min. Blind/Buried Via Hole Size (Drilled) | 0.010 |
0.008 |
0.006 |
| Min. Line & Space | 0.005 |
0.004 |
0.003 |
| Line Width Tolerance +/- | 0.001 |
0.00075 |
0.0005 |
| Layer to Layer Registration +/- | 0.005 |
0.004 |
0.003 |
DFM / DRC / DFC
DFM (Design For Manufacture) optimizes the board design for our manufacturing processes. This lets us be as efficient as possible when fabricating your product.
DRC (Design Rule Check) allows us to check specific criteria in a board design to ensure high quality finished product. Examples of Design Rule Checks are as follows:
- Drill Check: Identifies missing holes, duplicated hits, annular ring, etc.
- Signal Layer Check: Identifies spacing and line width violations, annular ring, etc.
- Power Ground Check: Identifies spoke width, clearance size, power to ground shorts, etc.
- Soldermask Check: Identifies soldermask clearance, copper to soldermask distance, etc.
DFC (Design For Cost) emphasizes the most economical way to manufacture a specific board. This includes optimal panelization to ensure that waste is at a minimum.
"Recently Lazer-tech produced a series of PCBs for us on a 3-day delivery schedule. We received support from Lazer-tech every step of the way, from order entry to delivery, working together to achieve the goal. As a result, we were successful in meeting our customer's needs and secured the business. Thanks to everyone involved at Lazer-tech!" Ross, QSDM Inc.